doc. RNDr. Vilma Buršíková, Ph.D.
Associate professor, Deposition of Thin films and Nanostructures
Office: pav. 06/02006
Kotlářská 267/2
611 37 Brno
Phone: | +420 549 49 3368 |
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E‑mail: |
social and academic networks: |
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Total number of publications: 521
2021
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INDUSTRIAL MAGNETRON SPUTTERING OF ZRN/CU NANOSTRUCTURED COATINGS FOR ANTI-BACTERIAL PURPOSES
Proceedings 13th International Conference on Nanomaterials - Research & Application, year: 2021
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Introducing force traceability to nanoindentation measurements
NANOCON 2020: 12th International Conference on Nanomaterials - Research & Application, year: 2021
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MAGNETRON SPUTTERING DEPOSITION OF HIGH ENTROPY NITRIDES FROM CHROMIUM-HAFNIUM-MOLYBDENUM-TANTALUM-WOLFRAM SYSTEM
13th International Conference on Nanomaterials - Research and Application, NANOCON 2021, year: 2021
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Organosilicon plasma polymers deposited in trimethylsilyl acetate/CH4 plasma of capacitively coupled RF glow discharge
NANOCON 2020: 12th International Conference on Nanomaterials - Research & Application, year: 2021
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Phase formation, thermal stability and mechanical properties of Nb-B-C thin films prepared by magnetron sputtering using a combinatorial approach
Year: 2021, type: Conference abstract
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Stability of trimethylsilyl acetate-based plasma polymers towards atmospheric and water environments
Polymer Degradation and Stability, year: 2021, volume: 190, edition: August, DOI
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The Industrially Deposited W-B-C Coatings from Segmented Target
Year: 2021, type: Conference abstract
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Thermal stability of Ti/Ni multilayer Thin films
NANOCON 2020: 12th International Conference on Nanomaterials - Research & Application, year: 2021
2020
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A comparative study of sioxcyhz thin films deposited in trimethysilyl ACETATE/O2/Ar plasmas
11th International Conference on Nanomaterials - Research & Application (NANOCON 2019), year: 2020
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Adhesion and dynamic impact wear of nanocomposite TiC-based coatings prepared by DCMS and HiPIMS
International Journal of Refractory Metals and Hard Materials, year: 2020, volume: 86, edition: JAN 2020, DOI