Publication details
MECHANICAL PROPERTIES AND MICROSTRUCTURE OF MODEL LEAD-FREE JOINTS FOR ELECTRONICS MADE WITH USE OF NANOPOWDERS
| Authors | |
|---|---|
| Year of publication | 2012 |
| Type | Article in Periodical |
| Magazine / Source | Chemické listy |
| MU Faculty or unit | |
| Citation | |
| Field | Other materials |
| Keywords | solder; silver nanopowder; nanoindentation |
| Description | Microstructure of Model Lead-Free Joints for Electronics Made with Use of Nanopowders Ag nanopowders were prepared as potential low-toxic constituents of novel solders by a chemical wet synthesis. Resulting nanoparticles were characterized using a transmission electron microscope. Model joints, i.e. sandwiches consisting of thin copper plates with Ag nanopowder interlayer were prepared and annealed at various temperatures. Metallographic cross-sections were studied using a scanning electron microscope. The main emphasis was placed on the characterization of sintered Ag layers on cross-sections by means of nanoindentation experiments. Microhardness and other mechanical properties of sintered Ag layers were measured by instrumented indentation with Berkovich indenter. Both the mechanical properties and the observed microstructure were compared with our previous results obtained on similar materials. |