Interaction of elements in the copper/indium-tin diffusion joints at 400 and 600 oC

• Authors: DRÁPALA Jaromír; KOZELKOVÁ Renata; KUBÍČEK Petr; VŘEŠŤÁL Jan; KROUPA Aleš
• Year of publication: 2007
• Type: Article in Periodical
• Magazine / Source: University Review
• MU Faculty or unit: Faculty of Science
• Field: Thermodynamics
• Keywords: reaction diffusivity; copper/indium/tin ternary system
• Description: New experimetal data describing phase equilibria in the Cu-In-Sn system after long-term diffusion annealing at the 400 and 600 oC are presented.

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