Publication details
Thermal analysis of Sn, Ag and Cu Nanopowders
| Authors | |
|---|---|
| Year of publication | 2008 |
| Type | Article in Proceedings |
| Conference | CALPHAD XXXVII |
| MU Faculty or unit | |
| Citation | |
| Field | Physical chemistry and theoretical chemistry |
| Keywords | thermal analysis; nanopowders; CALPHAD |
| Description | Theoretical and experimental study on Sn, Ag and Cu nanopowders in connection with currently used lead-free solders was performed. The experimental investigation involved DSC measurements by means of STA 409 CD/3/5/G apparatus from Netzsch. In order to explain experimental observations including oxidation and coagulation, theoretical calculations based on the CALPHAD approach were performed. |
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